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NC 264-5 is a resin-free, halide-free, wave solder flux designed to enhance wetting and prevent bridging during the wave soldering process. NC 264-5 offers an enhanced activity level, as well as lower surface tension than other flux chemistries. NC 264-5 performs well with bare copper,solder coated and organic coated PWBs. This material leaves negligible post-process residues that are non-conductive and do not require post-process cleaning for most assemblies.
Physical Properties:
Handling:
Flux Application:
NC 264-5 is formulated for application via spray, foam, brush, mist, or dip.
For Spraying, NC 264-5 is ready to use directly from its container, no thinning required. When spray fluxing, it isimperative that proper flux coverage and uniformity be achieved and maintained. A dry flux coating of 500 to 1500micrograms per square inch is recommended as a starting point.
When Nitrogen sealed wave solder equipment is used, it is generally necessary to apply slightly more flux than normal as a result of excess drying due to the extended length of the equipment.
When Foaming, air stones should be supplied with compressed air, free of oil and moisture. Adjust foam headto achieve uniform bubble size for optimum coverage. During foaming applications, it is periodically necessary toadd AIM’s Common Flux Thinner to replace that which islost due through evaporation.
Monitoring and controlling the acid number is recommended for maintaining the flux composition. The acid number shouldbe maintained between 18.9 –19. 9MG KOH/GRAM.
