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S732WH310 310ML SILASTIC SILICON - WHITE
For general industrial sealing and bonding applications
How to Use
Substrate Preparation
- All surfaces must be clean and dry.
- Degrease and wash off any contaminants that could impair adhesion.
- Suitable solvents include isopropyl alcohol, acetone or methyl ethyl ketone.
- Unprimed adhesion may be obtained on many substrates such as glass, metals and most
common engineering plastics. - Substrates to which good adhesion is normally not obtained include PTFE, polyethylene, polypropylene and related materials.
- However, for maximum adhesion, the use of DOWSIL™ 1200 OS Primer is recommended.
- After solvent cleaning, a thin coat of DOWSIL™ 1200 OS Primer is applied by dipping,
brushing or spraying. - Allow primer to dry for 15 to 90 minutes at room temperature and a relative humidity of 50% or higher.
How to Apply
- Apply DOWSIL™ 732 Multi-Purpose Sealant to one of the prepared surfaces, then quickly cover with the other substrate to be bonded.
- On exposure to moisture, the freshly applied material will "skin-over". Any tooling should be completed before this skin forms.
- The surface is easily tooled with a spatula.
- The adhesive/sealant will be tack-free in less than 45 minutes.
Cure Time
- After skin formation, cure continues inward from the surface. In 24 hours (at room temperature and 50% relative humidity) DOWSIL™ 732 Multi-Purpose Sealant will cure to a depth of about 3 mm. Very deep sections, especially when access to atmospheric moisture is restricted will take longer to cure completely.
- Cure time is extended at lower humidity levels.
- Before handling and packaging bonded components, users are advised to wait a sufficiently long time to ensure that the integrity of the adhesive seal is not affected.
- This will depend on many factors and should be determined by the user for each specific application.
Features:
- One-part adhesive/sealant
- Cures at room temperature when exposed to moisture in the air
- Acetoxy cure system
- Non-sag, paste consistency
- Easy to apply
- Cures to a tough, flexible rubber
- Good adhesion to many substrates
- Stable and flexible from -60°C to +180°C (-76°F to +356°F), with short peaks up to +205°C (401°F)
- Black version: stable and flexible from -60°C to +205°C (-76°F to +401°F), with short peaks up to +230°C (446°F)
- Excellent dielectric properties
- Complies with MIL-A-46106
- Complies with FDA 177.2600
- White
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