$142.10
Successfully Tried and Tested
Leading electronics manufacturers throughout the world have used SN100C with outstanding results. To date, millionsof circuit boards have been assembled with the SN100C familyof solders in all types of products. Many of the devices soldered with SN100C already have been in use for several years.
Nihon Superior have developed SN100C 030 solder wire. One of its major points is that it is the only lead free alloy that looks and flows like normal tin/lead. SN100C is comprised of Sn/Cu/Ni + Ge. (TIN, COPPER, NICKEL & GERMANIUM)
The flux-cored solder wire enables fast soldering with less carbonizing of soldering tip and less flux spatter providing greater productivity than existing products.
SN100C (030) lead-free flux-cored solder wire provides sharp spreading and good separation.
The high-reliability alloy suits fine-pitch application. It contributes to higher economic productivity with its improved efficiency over conventional products.
SN100C (030) also reduces bridging in soldering extra-fine coaxial harnessing in cell phones.
The alloy (Sn0.7Cu0.05Ni Ge) has a 0.1-mm diameter. SN100C (030) inhibits growth of the intermetallic layer and lowers copper erosion. Its highly ductile properties accommodate for strain on joints.
Key Benifits Include:
Material Property | SN100C | Test method | |
Melting Temperature [°C] | Solidus 227 | Ramp ratefor different thermal analysis 20°/min | |
Liquidus 227 | |||
S.G. | 7.4 | S.G. measuring apparatus 25° | |
Specific Heat | 220 | Estimated value | |
Thermal conductivity | 64 | Estimated value | |
Vickers Hardness | Slow cooling | 16.1 | Cast onto aluminum plate |
Fast cooling | 12.9 | Cast onto insulating brick | |
Tensile strength | 32 | 10mm/min. (25°) | |
Elongation [%] | 48 | 10mm/min. (25°) | |
Electrical resistance | 0.13 | For Terminal method (25°) | |
Material Property | SN100C | Test method | |||
Coefficient of Thermal Expansion | 30-80° | 1.33x10-3 | Conditions: Load: 10.0grams, sample ;Almina (20mm), Programmed temperature: 10°/min. | ||
80-130° | 1.38x10-3 | ||||
130-180° | 1.46x10-3 | ||||
Spread Factor % | 240° | 77 | JIS Z 3197 | ||
250° | 77 | ||||
260° | 78 | ||||
280° | 78 | ||||
Creep Strength (Time to Failure) | 145° | >300 hours | 145° load 1 kg | ||
150° | >300 hours | 150° load 1 kg | |||
180° | >300 hours | 180° load 1 kg | |||
Wettability Seconds |
| Ta | Tb | Fmax |
Wetting Balance
0.3 X 3.5 X 25 mm
Ta = Zero cross time
Tb = Wetting time
Fmax = Max. wetting force
|
240° | 1.0 | 4.53 | 0.159 | ||
250° | 0.86 | 2.79 | 0.181 | ||
260° | 0.47 | 1.46 | 0.186 | ||
270° | 0.31 | 0.8 | 0.192 | ||
Copper erosion rate at 260° | ~ 2 minutes | Time for complete erosion of 0.18mmΦ wire | |||
Thermal shock | >1,000 cycles | -40/+80° each 1hr | |||
Electromigration | >1,000 hrs | 40° 95%RH & 85° 85%RH | |||
Whiskers | >1,000 hrs | 50° | |||
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